Having seen spectroscopy systems in the semiconductor industry in the 1980s, this seems like about as small a package as I can ever remember. Is this indeed smaller than the current state of the art? Has anyone else used a system on a chip approach like this one, Ann?
There's a large number of apps that could take advantage of this technology. Industrial machine vision and inspection of chips, boards and electronics sub-assemblies, R&D of several different kinds including component failure and analysis labs, medical labs of various kinds, and medical equipment manufacturing. It could possibly also be used in various kinds of materials detection, possibly in security apps, as well as for detecting counterfeit components made of inferior materials.
What I like most about this technology is the huge difference in size between other multispectral cameras I've written about in the past and the fact that this is a chip-level solution, even doing post-processing filters on-chip. I think the need for this technology will only continue to increase as design features keep getting smaller, and with the mixes of multiple material types.
This slideshow includes several versions of multi-materials machines, two different composites processes including one at microscale, and two vastly different metals processes. Potential game-changers down the line include three microscale processes.
UL is partnering with metals additive manufacturing (AM) supplier EOS to provide AM training to EOS's customers. It's designed to promote correct usage of AM technologies by OEMs and others in manufacturing.
To commemorate Earth Day, we take a look at the state of ocean plastic. If things don't change, by 2050 the oceans will contain more plastic than fish by weight. Here are the problems, as well as some solutions.
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