Having seen spectroscopy systems in the semiconductor industry in the 1980s, this seems like about as small a package as I can ever remember. Is this indeed smaller than the current state of the art? Has anyone else used a system on a chip approach like this one, Ann?
There's a large number of apps that could take advantage of this technology. Industrial machine vision and inspection of chips, boards and electronics sub-assemblies, R&D of several different kinds including component failure and analysis labs, medical labs of various kinds, and medical equipment manufacturing. It could possibly also be used in various kinds of materials detection, possibly in security apps, as well as for detecting counterfeit components made of inferior materials.
What I like most about this technology is the huge difference in size between other multispectral cameras I've written about in the past and the fact that this is a chip-level solution, even doing post-processing filters on-chip. I think the need for this technology will only continue to increase as design features keep getting smaller, and with the mixes of multiple material types.
In his keynote address at the RAPID 2015 conference last week, Made In Space CTO Jason Dunn gave an update on how far his company and co-development partner NASA have come in their quest to bring 3D printing to the space station -- and beyond.
A composite based on a high-performance PEEK-like resin we told you about two years ago when it was still in R&D has now been licensed by the US Naval Research Laboratory (NRL) for commercial manufacturing.
Microsoft, HP, Dassault, and other industry heavyweights in 3D printing have launched a new 3DP file format, 3MF. The consortium says the spec will more fully describe a 3D model and will be interoperable with multiple applications, platforms, services, and printers.
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