Active investigation continues on various alloys used to replace lead for soldering in electronics components. Use of lead has dropped since the Restriction of Hazardous Substances Directive took effect in July, 2006. Historically, interconnections in electronic components have been made using tin/lead solder formulations. Those materials melt at 183C, while the thermoset and thermoplastics used in electronics have temperature limits up to 235C. The glass transition temperature of FR-4, a common PCB material, is between 140-175C. The resin softens as temperatures rise. New lead-free alternates such as SAC become liquid at 217C. Other lead-free solders have even higher melting points, causing failures of laminates and thermoplastics. Materials suppliers are struggling to adapt, says James Hall of ITM Consulting, who gave an interesting overview of the issue during a conference session at National Manufacturing Week in Rosemont, IL. “Just increasing cross-linking in the modified epoxies used in laminates is not the way to go,” he says. Cross-linking increases the brittleness of the laminates, creating problems when the boards are drilled. Specialty thermoplastics, such as modified nylons, are also experiencing problems because of the high solder temperatures. Explorations continue on new plastics as well as new solder formulations, including significant use of dopants such as nickel and germanium that provide specific property enhancements for various reasons.
Last week, the bill for reforming chemical regulation, the TSCA Modernization Act of 2015, passed the House. If it or a similar bill becomes law, the effects on cost and availability of adhesives and plastics incorporating these substances are not yet clear.
The latest crop of coating and sealant materials and devices has impressive credentials. Many are designed for tough environments with broad operating temperature ranges, and they often cure faster, require fewer process steps, and produce less waste.
A new program has been proposed for testing and certify 3D printing filaments for emissions safety. To engineers who've used 3D printers at home this is a no-brainer. It's from a consumer on Kickstarter, and targets use in homes and schools.
For the last 50 years, the Metal Powder Industries Federation (MPIF) has sponsored an awards competition for creative solutions to designing and fabricating near-net-shape parts using powder metal (PM) technologies. Here are the seven Grand Prize winners of the 2015 contest.
Graphene 3D Lab has added graphene to 3DP PLA filament to strengthen the material and add conductivity to prints made with it. The material can be used to 3D print conductive traces embedded in 3D-printed parts for electronics, as well as capacitive touch sensors.
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