Active investigation continues on various alloys used to replace lead for soldering in electronics components. Use of lead has dropped since the Restriction of Hazardous Substances Directive took effect in July, 2006. Historically, interconnections in electronic components have been made using tin/lead solder formulations. Those materials melt at 183C, while the thermoset and thermoplastics used in electronics have temperature limits up to 235C. The glass transition temperature of FR-4, a common PCB material, is between 140-175C. The resin softens as temperatures rise. New lead-free alternates such as SAC become liquid at 217C. Other lead-free solders have even higher melting points, causing failures of laminates and thermoplastics. Materials suppliers are struggling to adapt, says James Hall of ITM Consulting, who gave an interesting overview of the issue during a conference session at National Manufacturing Week in Rosemont, IL. “Just increasing cross-linking in the modified epoxies used in laminates is not the way to go,” he says. Cross-linking increases the brittleness of the laminates, creating problems when the boards are drilled. Specialty thermoplastics, such as modified nylons, are also experiencing problems because of the high solder temperatures. Explorations continue on new plastics as well as new solder formulations, including significant use of dopants such as nickel and germanium that provide specific property enhancements for various reasons.
The new composites manufacturing innovation center is intended to be a source of grand challenges for industry, like the kind that got us to the moon under JFK. These aren't the words its new CEO Craig Blue used, but that's the idea and the vision behind the Institute for Advanced Composites Manufacturing Innovation (IACMI).
The 100% solar-powered airplane Solar Impulse 2 is prepping for its upcoming flight, becoming the first plane to fly around the world without using fuel. It's able to do so because of above-average performance by all of the technologies that go into it, especially materials.
As the 3D printing and overall additive manufacturing ecosystem grows, standards and guidelines from standards bodies and government organizations are increasing. Multiple players with multiple needs are also driving the role of 3DP and AM as enabling technologies for distributed manufacturing.
A growing though not-so-obvious role for 3D printing, 4D printing, and overall additive manufacturing is their use in fabricating new materials and enabling new or improved manufacturing and assembly processes. Individual engineers, OEMs, university labs, and others are reinventing the technology to suit their own needs.
For vehicles to meet the 2025 Corporate Average Fuel Economy (CAFE) standards, three things must happen: customers must look beyond the data sheet and engage materials supplier earlier, and new integrated multi-materials are needed to make step-change improvements.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.