Active investigation continues on various alloys used to replace lead for soldering in electronics components. Use of lead has dropped since the Restriction of Hazardous Substances Directive took effect in July, 2006. Historically, interconnections in electronic components have been made using tin/lead solder formulations. Those materials melt at 183C, while the thermoset and thermoplastics used in electronics have temperature limits up to 235C. The glass transition temperature of FR-4, a common PCB material, is between 140-175C. The resin softens as temperatures rise. New lead-free alternates such as SAC become liquid at 217C. Other lead-free solders have even higher melting points, causing failures of laminates and thermoplastics. Materials suppliers are struggling to adapt, says James Hall of ITM Consulting, who gave an interesting overview of the issue during a conference session at National Manufacturing Week in Rosemont, IL. “Just increasing cross-linking in the modified epoxies used in laminates is not the way to go,” he says. Cross-linking increases the brittleness of the laminates, creating problems when the boards are drilled. Specialty thermoplastics, such as modified nylons, are also experiencing problems because of the high solder temperatures. Explorations continue on new plastics as well as new solder formulations, including significant use of dopants such as nickel and germanium that provide specific property enhancements for various reasons.
Many of the new adhesives we're featuring in this slideshow are for use in automotive and other transportation applications. The rest of these new products are for a wide variety of applications including aviation, aerospace, electrical motors, electronics, industrial, and semiconductors.
A Columbia University team working on molecular-scale nano-robots with moving parts has run into wear-and-tear issues. They've become the first team to observe in detail and quantify this process, and are devising coping strategies by observing how living cells prevent aging.
Many of the new materials on display at MD&M West were developed to be strong, tough replacements for metal parts in different kinds of medical equipment: IV poles, connectors for medical devices, medical device trays, and torque-applying instruments for orthopedic surgery. Others are made for close contact with patients.
New sensor technology integrates sensors, traces, and electronics into a smart fabric for wearables that measures more dimensions -- force, location, size, twist, bend, stretch, and motion -- and displays data in 3D maps.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.