Active investigation continues on various alloys used to replace lead for soldering in electronics components. Use of lead has dropped since the Restriction of Hazardous Substances Directive took effect in July, 2006. Historically, interconnections in electronic components have been made using tin/lead solder formulations. Those materials melt at 183C, while the thermoset and thermoplastics used in electronics have temperature limits up to 235C. The glass transition temperature of FR-4, a common PCB material, is between 140-175C. The resin softens as temperatures rise. New lead-free alternates such as SAC become liquid at 217C. Other lead-free solders have even higher melting points, causing failures of laminates and thermoplastics. Materials suppliers are struggling to adapt, says James Hall of ITM Consulting, who gave an interesting overview of the issue during a conference session at National Manufacturing Week in Rosemont, IL. “Just increasing cross-linking in the modified epoxies used in laminates is not the way to go,” he says. Cross-linking increases the brittleness of the laminates, creating problems when the boards are drilled. Specialty thermoplastics, such as modified nylons, are also experiencing problems because of the high solder temperatures. Explorations continue on new plastics as well as new solder formulations, including significant use of dopants such as nickel and germanium that provide specific property enhancements for various reasons.
A new service lets engineers and orthopedic surgeons design and 3D print highly accurate, patient-specific, orthopedic medical implants made of metal -- without owning a 3D printer. Using free, downloadable software, users can import ASCII and binary .STL files, design the implant, and send an encrypted design file to a third-party manufacturer.
A recent report sponsored by the American Chemistry Council (ACC) focuses on emerging gasification technologies for converting waste into energy and fuel on a large scale and saving it from the landfill. Some of that waste includes non-recycled plastic.
Capping a 30-year quest, GE Aviation has broken ground on the first high-volume factory for producing commercial jet engine components from ceramic matrix composites. The plant will produce high-pressure turbine shrouds for the LEAP Turbofan engine.
Seismic shifts in 3D printing materials include an optimization method that reduces the material needed to print an object by 85 percent, research designed to create new, stronger materials, and a new ASTM standard for their mechanical properties.