Active investigation continues on various alloys used to replace lead for soldering in electronics components. Use of lead has dropped since the Restriction of Hazardous Substances Directive took effect in July, 2006. Historically, interconnections in electronic components have been made using tin/lead solder formulations. Those materials melt at 183C, while the thermoset and thermoplastics used in electronics have temperature limits up to 235C. The glass transition temperature of FR-4, a common PCB material, is between 140-175C. The resin softens as temperatures rise. New lead-free alternates such as SAC become liquid at 217C. Other lead-free solders have even higher melting points, causing failures of laminates and thermoplastics. Materials suppliers are struggling to adapt, says James Hall of ITM Consulting, who gave an interesting overview of the issue during a conference session at National Manufacturing Week in Rosemont, IL. “Just increasing cross-linking in the modified epoxies used in laminates is not the way to go,” he says. Cross-linking increases the brittleness of the laminates, creating problems when the boards are drilled. Specialty thermoplastics, such as modified nylons, are also experiencing problems because of the high solder temperatures. Explorations continue on new plastics as well as new solder formulations, including significant use of dopants such as nickel and germanium that provide specific property enhancements for various reasons.
Instead of sifting through huge amounts of technical data looking for answers to assembly problems, engineers can now benefit from 3M's new initiative -- 3M Assembly Solutions. The company has organized its wealth of adhesive and tape solutions into six typical application areas, making it easier to find the best products to solve their real-world assembly and bonding problems.
Many of the materials in this slideshow are resins or elastomers, plus reinforced materials, styrenics, and PLA masterbatches. Applications range from automotive and aerospace to industrial, consumer electronics and wearables, consumer goods, medical and healthcare, as well as sporting goods, and materials for protecting food and beverages.
Engineers trying to keep track of the ever-ballooning number of materials and machines for additive manufacturing and 3D printing now have some relief: a free searchable database with more than 350 machines and 450 different materials.
At JEC Europe Dow Automotive introduced a new ultra-fast, under-60-second molding cycle time for its commercial-grade VORAFORCE 5300 epoxy resin matrix for carbon composites. It's aimed at high-volume automotive manufacturing.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.