Increasingly novel materials applications are emerging to provide lightweight thermal management functions in aircraft (such as the Boeing Dreamliner) and oher applications. One example is a metal matrix composite developed by a company called CPS Technologies in Norton, MA. In a typical component, a silicon carbide structure is formed in a plunger-type, low-pressure injection molding machine that uses a carrier feedstock that freezes near zero C. The carrier is removed by a phase management sublimation in which the carrier never becomes a liquid. The product can then either be sintered or infiltrated with material such as aluminum.
CPS says that AlSiC produces hermetic packaging that is much lighter than CuMo and CuW, yet has similar thermal conductivity and expansion coefficient. It also costs less.
Most of the new 3D printers and 3D printing technologies in this crop are breaking some boundaries, whether it's build volume-per-dollar ratios, multimaterials printing techniques, or new materials types.
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