Engineers still need to make tradeoffs when trying to achieve improved thermal conductivity in plastics. One of the biggest challenges in plastics design today is efficient heat removal from smaller components, some of which operate at higher voltages. Example: LED arrays are becoming more popular in auto headlamps to conserve energy. Research data presented by DuPont at its pre-K 2007 press conference in Prague show three different approaches: 1) Use of high filler content including carbon fiber achieves a high rate of thermal conductivity but is difficult to mold, 2) Boron nitride coated graphite coupled with copper particles coated with glass also work well, but are not cost effective and also have molding issues, and 3) Use of ceramic particles as fillers does not achieve the level of thermal conductivity required by emerging applications.
Last week, the bill for reforming chemical regulation, the TSCA Modernization Act of 2015, passed the House. If it or a similar bill becomes law, the effects on cost and availability of adhesives and plastics incorporating these substances are not yet clear.
The latest crop of coating and sealant materials and devices has impressive credentials. Many are designed for tough environments with broad operating temperature ranges, and they often cure faster, require fewer process steps, and produce less waste.
A new program has been proposed for testing and certify 3D printing filaments for emissions safety. To engineers who've used 3D printers at home this is a no-brainer. It's from a consumer on Kickstarter, and targets use in homes and schools.
For the last 50 years, the Metal Powder Industries Federation (MPIF) has sponsored an awards competition for creative solutions to designing and fabricating near-net-shape parts using powder metal (PM) technologies. Here are the seven Grand Prize winners of the 2015 contest.
Graphene 3D Lab has added graphene to 3DP PLA filament to strengthen the material and add conductivity to prints made with it. The material can be used to 3D print conductive traces embedded in 3D-printed parts for electronics, as well as capacitive touch sensors.
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