Announcements of new polymers are infrequent, with most of the action coming in additive systems that enhance performance or processability. DSM Engineering Plastics says it has developed a “breakthrough” polymer called PA4T, a specialized nylon aimed at electronics miniaturization. Specific attributes include excellent dimensional stability, compatibility with lead free soldering, high stiffness and mechanical strength at elevated temperatures, high melting point, and excellent flow and processing window. Potential applications include memory card connectors, CPU sockets, and air/fuel and power train components. A market development plant in the Netherlands will open early next year.
A composite based on a high-performance PEEK-like resin we told you about two years ago when it was still in R&D has now been licensed by the US Naval Research Laboratory (NRL) for commercial manufacturing.
Microsoft, HP, Dassault, and other industry heavyweights in 3D printing have launched a new 3DP file format, 3MF. The consortium says the spec will more fully describe a 3D model and will be interoperable with multiple applications, platforms, services, and printers.
NASA's been working on several different ongoing projects for 3D-printed rocket engine components in metals and now it's reached another first in aerospace 3D printing: a full-scale, 3D-printed rocket engine component made of copper.
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