Announcements of new polymers are infrequent, with most of the action coming in additive systems that enhance performance or processability. DSM Engineering Plastics says it has developed a “breakthrough” polymer called PA4T, a specialized nylon aimed at electronics miniaturization. Specific attributes include excellent dimensional stability, compatibility with lead free soldering, high stiffness and mechanical strength at elevated temperatures, high melting point, and excellent flow and processing window. Potential applications include memory card connectors, CPU sockets, and air/fuel and power train components. A market development plant in the Netherlands will open early next year.
University of Southampton researchers have come up with a way to 3D print transparent optical fibers like those used in fiber-optic telecommunications cables, potentially boosting frequency and reducing loss.
The first ASME Additive Manufacturing + 3D Printing Conference (AM3D) will be co-located with the organization's International Design and Engineering Technical Conferences (IDETC) and Computers & Information in Engineering Conference (CIE), Aug 2-5 in Boston.
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