Japanese OEMs, particularly in the electronics and IT fields, are leading the way on engineering applications for plant-based plastics. The latest: Fujitsu is testing a new polymer that uses caster oil extracted from the seeds of the caster bean. The new polymer is being tested for small components in notebook PCs and for mobile phones. A target application is connector covers. Five years ago, Fujitsu was one of the pioneers, using polymers based on corn-based polylactic acid in the chassis of a notebook PC. The goal of the new polymer, developed with Arkema, is better flexibility.
Instead of sifting through huge amounts of technical data looking for answers to assembly problems, engineers can now benefit from 3M's new initiative -- 3M Assembly Solutions. The company has organized its wealth of adhesive and tape solutions into six typical application areas, making it easier to find the best products to solve their real-world assembly and bonding problems.
Many of the materials in this slideshow are resins or elastomers, plus reinforced materials, styrenics, and PLA masterbatches. Applications range from automotive and aerospace to industrial, consumer electronics and wearables, consumer goods, medical and healthcare, as well as sporting goods, and materials for protecting food and beverages.
Engineers trying to keep track of the ever-ballooning number of materials and machines for additive manufacturing and 3D printing now have some relief: a free searchable database with more than 350 machines and 450 different materials.
At JEC Europe Dow Automotive introduced a new ultra-fast, under-60-second molding cycle time for its commercial-grade VORAFORCE 5300 epoxy resin matrix for carbon composites. It's aimed at high-volume automotive manufacturing.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.