Forty-five percent of serious plastics product failures result from inappropriate materials selection, said Melissa Kurtz, senior materials scientist at Stork Technimet Inc. in a lively discussion on failure analysis at the annual technical conference of the Society of Plastics Engineers in Milwaukee, WI. “This is especially true in applications involving chemical attack and environmental stress cracking,” she said. In one example she cited a phthalic-based plasticizer used in a rubber seal caused environmental stress cracking of polyetherimide in a medical device. In a panel discussion, a General Motors engineer asked for tips on how to determine if excessive use of captive regrind could be causing a part failure. Experts suggested testing melt index of material before molding to determine if the molecular weight was out of range.
Last week, the bill for reforming chemical regulation, the TSCA Modernization Act of 2015, passed the House. If it or a similar bill becomes law, the effects on cost and availability of adhesives and plastics incorporating these substances are not yet clear.
The latest crop of coating and sealant materials and devices has impressive credentials. Many are designed for tough environments with broad operating temperature ranges, and they often cure faster, require fewer process steps, and produce less waste.
A new program has been proposed for testing and certify 3D printing filaments for emissions safety. To engineers who've used 3D printers at home this is a no-brainer. It's from a consumer on Kickstarter, and targets use in homes and schools.
For the last 50 years, the Metal Powder Industries Federation (MPIF) has sponsored an awards competition for creative solutions to designing and fabricating near-net-shape parts using powder metal (PM) technologies. Here are the seven Grand Prize winners of the 2015 contest.
Graphene 3D Lab has added graphene to 3DP PLA filament to strengthen the material and add conductivity to prints made with it. The material can be used to 3D print conductive traces embedded in 3D-printed parts for electronics, as well as capacitive touch sensors.
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