This article from PCB007is the first part of a new series of articles on the important emerging area of solderless assembly technology.
The first article is a bit of an experiment in information dissemination. In an industry as fast paced as the electronics industry, one often finds oneself reading technology texts that are more akin to history books. Traditional texts will always have a vital roll to play in information transfer, but real-time examination of rapidly evolving technologies cannot be carried out in such a manner. This effort is PCB007’s first attempt at offering a near real-time text on an emerging technology.