The release says the product eliminates galvanic corrosion, preventing yield loss from circuit breaks. Deposits maintain solderability after multiple lead-free PCB assembly reflow cycles.
The following statement was part of Dow’s release:
TinpositTM LF Immersion Tin
The latest in immersion tin technology providing high reliability and solderability for interconnect applications
Maintains excellent solderability after multiple lead-free PCB assembly reflow cycles, improving manufacturing process capability and yield;
Outstanding solder joint reliability, resulting from excellent bonding force between PCB pad and reflowed solder paste;
No tin whisker formation, increasing product reliability and avoiding short-circuits between closely spaced circuit features;
Effectively eliminates galvanic corrosion preventing yield loss from circuit breaks;
Significantly reduced attack on solder mask
Tinposit(TM) LF Immersion Tin produces uniform and solderable tin deposits on properly prepared PWB substrates and is specifically formulated to be used in lead-free
assembly processes. The deposits can maintain good solderability after multiple reflow processes. The Tinposit(TM) LF Immersion Tin bath is easy to control and has a high
tolerance for contaminants.
For industrial control applications, or even a simple assembly line, that machine can go almost 24/7 without a break. But what happens when the task is a little more complex? That’s where the “smart” machine would come in. The smart machine is one that has some simple (or complex in some cases) processing capability to be able to adapt to changing conditions. Such machines are suited for a host of applications, including automotive, aerospace, defense, medical, computers and electronics, telecommunications, consumer goods, and so on. This discussion will examine what’s possible with smart machines, and what tradeoffs need to be made to implement such a solution.