The Association Connecting Electronics Industries (IPC) has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Patter Standard.IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
The B revision of the standard expands its lead free coverage with the addition of new solder alloys and presents thoughtful discussion on etch-factor compensations at the designer level as well as at printed board fabrication. In addition, IPC-7351 has been edited significantly by users of the standard to enhance its clarity and understanding.
For industrial control applications, or even a simple assembly line, that machine can go almost 24/7 without a break. But what happens when the task is a little more complex? That’s where the “smart” machine would come in. The smart machine is one that has some simple (or complex in some cases) processing capability to be able to adapt to changing conditions. Such machines are suited for a host of applications, including automotive, aerospace, defense, medical, computers and electronics, telecommunications, consumer goods, and so on. This discussion will examine what’s possible with smart machines, and what tradeoffs need to be made to implement such a solution.