Current alloy systems in use - why and how they were chosen
The reliability of different alloy systems
Preferred printed board finishes for lead-free assembly
Concerns with lead-free components
Solder paste selection
Best practices for setting up a RoHS-compliant process
How to prevent process defects
Strategies of two successful process implementations
The workshop will be presented by Ronald C. Lasky, Ph.D., PE, an instructional professor and a Six Sigma master black belt instructor at the Thayer School of Engineering, Dartmouth College. Dr. Lasky serves as director of the Cook Engineering Design Center and as a senior technologist at Indium Corporation of America. He has more than 30 years of experience in electronic and optoelectronic packaging including work at IBM, Universal Instruments and Cookson. The author of five books, Dr. Lasky holds a doctorate in materials science.
For industrial control applications, or even a simple assembly line, that machine can go almost 24/7 without a break. But what happens when the task is a little more complex? That’s where the “smart” machine would come in. The smart machine is one that has some simple (or complex in some cases) processing capability to be able to adapt to changing conditions. Such machines are suited for a host of applications, including automotive, aerospace, defense, medical, computers and electronics, telecommunications, consumer goods, and so on. This discussion will examine what’s possible with smart machines, and what tradeoffs need to be made to implement such a solution.