German-based solder producer, Henkel AG & Co., has developed and launched Multicore LF620, a new lead-free solder paste designed for demanding requirements of regions with temperatures of 85 degrees Fahrenheit or more and upwards of 80 percent humidity.
Henkel notes the LF620 is a no-clean, halide-free, lead-free solder paste created for a broad process window for printing, reflow and humidity resistance. The solder was designed to ensure its consistent print performance with minimal hot slump even in regions with temperatures of 85 degrees Fahrenheit or more. Henkel says Multicore LF620 is well-suited for electronics firms that wish to use a single material for their worldwide operations, as its performance is designed to be unfailing regardless of extreme climate changes.
For industrial control applications, or even a simple assembly line, that machine can go almost 24/7 without a break. But what happens when the task is a little more complex? That’s where the “smart” machine would come in. The smart machine is one that has some simple (or complex in some cases) processing capability to be able to adapt to changing conditions. Such machines are suited for a host of applications, including automotive, aerospace, defense, medical, computers and electronics, telecommunications, consumer goods, and so on. This discussion will examine what’s possible with smart machines, and what tradeoffs need to be made to implement such a solution.