In the four years since the lead-free ban in electronics manufacturing went into effect, there has been a swarm of unintended consequences - new defects, reliability concerns, processing issues and challenges for high-reliability segments. With new research now available, lead-free implementation issues and solutions will be featured at the IPC APEX EXPO Technical Conference, April 6-8 in Las Vegas.
Sponsored by IPC - the Association Connecting Electronics Industries - the conference will include 35 technical sessions and feature 99 technical papers by renowned experts in printed board manufacture, electronics assembly, environmental regulations, materials and test. “Conference attendees this year will find a lot of sessions that delve directly into the concerns they’re experiencing on the factory floor,” says IPC Technical Conference Director Greg Munie. “We have sessions covering defects like pad cratering and head on pillow; tin whiskers; a new class of low-silver alloys that can better handle shock and vibration; and reliability and rework for high-reliability assemblies.”
A quick look into the merger of two powerhouse 3D printing OEMs and the new leader in rapid prototyping solutions, Stratasys. The industrial revolution is now led by 3D printing and engineers are given the opportunity to fully maximize their design capabilities, reduce their time-to-market and functionally test prototypes cheaper, faster and easier. Bruce Bradshaw, Director of Marketing in North America, will explore the large product offering and variety of materials that will help CAD designers articulate their product design with actual, physical prototypes. This broadcast will dive deep into technical information including application specific stories from real world customers and their experiences with 3D printing. 3D Printing is