In the four years since the lead-free ban in electronics manufacturing went into effect, there has been a swarm of unintended consequences - new defects, reliability concerns, processing issues and challenges for high-reliability segments. With new research now available, lead-free implementation issues and solutions will be featured at the IPC APEX EXPO Technical Conference, April 6-8 in Las Vegas.
Sponsored by IPC - the Association Connecting Electronics Industries - the conference will include 35 technical sessions and feature 99 technical papers by renowned experts in printed board manufacture, electronics assembly, environmental regulations, materials and test. “Conference attendees this year will find a lot of sessions that delve directly into the concerns they’re experiencing on the factory floor,” says IPC Technical Conference Director Greg Munie. “We have sessions covering defects like pad cratering and head on pillow; tin whiskers; a new class of low-silver alloys that can better handle shock and vibration; and reliability and rework for high-reliability assemblies.”
For industrial control applications, or even a simple assembly line, that machine can go almost 24/7 without a break. But what happens when the task is a little more complex? That’s where the “smart” machine would come in. The smart machine is one that has some simple (or complex in some cases) processing capability to be able to adapt to changing conditions. Such machines are suited for a host of applications, including automotive, aerospace, defense, medical, computers and electronics, telecommunications, consumer goods, and so on. This discussion will examine what’s possible with smart machines, and what tradeoffs need to be made to implement such a solution.