The High-Reliability RoHS Task Force at the International Electronics Manufacturing Initiative (iNEMI) has published recommendation for the lead-free manufacturing of complex, thermally challenging electronic assemblies. The recommendations – which focus primarily on thermal requirements for components, laminate and PWB materials and equipment – are intended to help ensure product reliability.
Most high-reliability products are exempt from RoHS lead-free regulations, but the components found in complex assemblies often include board component mixes, which means lead-free components will inevitable find their way into high-reliability assemblies as component manufacturers switch to mostly lead-free production and phase out their non-compliant inventory.
“These recommendations were developed to communicate the needs of the high-reliability segment to the supply chain and the relevant standards groups that muct address these needs,” says Joe Smetana, principal engineer of advanced technology for Alcatel and co-chair of the task force.
You can find the recommendations at the iNEMI website.