The International Electronics Manufacturing Initiative (iNEMI) has launched a new project to provide industry guidelines to help make the growing proliferation of lead-free alloys easier to manage. According to iNEMI, many BGA suppliers are changing the alloys used for lead-free solder balls to improve mechanical shock performance. Suppliers are also promoting a variety of wave solder alloys to address concerns about copper dissolution, barrel fill, common wave defects and the high cost of alloys. As a result, the variety of lead-free alloys is increasing. Several of these alloys have lower levels of silver and therefore a higher melting point (up to 10C or higher), which may require a change in printed circuit assembly manufacturing processes.
The first phase of this project will focus on the analysis of existing knowledge and assessment of critical gaps and on driving standards to help manage supply chain complexity and risk.
For industrial control applications, or even a simple assembly line, that machine can go almost 24/7 without a break. But what happens when the task is a little more complex? That’s where the “smart” machine would come in. The smart machine is one that has some simple (or complex in some cases) processing capability to be able to adapt to changing conditions. Such machines are suited for a host of applications, including automotive, aerospace, defense, medical, computers and electronics, telecommunications, consumer goods, and so on. This discussion will examine what’s possible with smart machines, and what tradeoffs need to be made to implement such a solution.