The International Electronics Manufacturing Initiative (iNEMI) has launched a new project to provide industry guidelines to help make the growing proliferation of lead-free alloys easier to manage. According to iNEMI, many BGA suppliers are changing the alloys used for lead-free solder balls to improve mechanical shock performance. Suppliers are also promoting a variety of wave solder alloys to address concerns about copper dissolution, barrel fill, common wave defects and the high cost of alloys. As a result, the variety of lead-free alloys is increasing. Several of these alloys have lower levels of silver and therefore a higher melting point (up to 10C or higher), which may require a change in printed circuit assembly manufacturing processes.
The first phase of this project will focus on the analysis of existing knowledge and assessment of critical gaps and on driving standards to help manage supply chain complexity and risk.
A quick look into the merger of two powerhouse 3D printing OEMs and the new leader in rapid prototyping solutions, Stratasys. The industrial revolution is now led by 3D printing and engineers are given the opportunity to fully maximize their design capabilities, reduce their time-to-market and functionally test prototypes cheaper, faster and easier. Bruce Bradshaw, Director of Marketing in North America, will explore the large product offering and variety of materials that will help CAD designers articulate their product design with actual, physical prototypes. This broadcast will dive deep into technical information including application specific stories from real world customers and their experiences with 3D printing. 3D Printing is