Elfnet (The European Lead-Free Soldering Network) has produced a roadmap on how key factors such as lead-free soldering, sustainability and miniaturization are impacting the interconnection supply chain, materials and processes. The report is titled, “The Future of European Electronics Interconnection,” and it is available for download at no cost.
The document presents 50 high-priority challenges in the field of electronics interconnection. According to Elfnet, these challenges need to be met over the coming decade. The roadmap also highlights future research and development directions needed to meet these challenges. The roadmap gives detailed information on 34 key interconnection topics and includes tables with quantified forecast data on electronics interconnection trends.
The EU-funded Elfnet network represents key European players in electronics interconnection research, including leading academics, research centers and industry partners. The groups has worked together in identifying issues and developing collaborative solutions during the transformation to lead-free soldering.
For industrial control applications, or even a simple assembly line, that machine can go almost 24/7 without a break. But what happens when the task is a little more complex? That’s where the “smart” machine would come in. The smart machine is one that has some simple (or complex in some cases) processing capability to be able to adapt to changing conditions. Such machines are suited for a host of applications, including automotive, aerospace, defense, medical, computers and electronics, telecommunications, consumer goods, and so on. This discussion will examine what’s possible with smart machines, and what tradeoffs need to be made to implement such a solution.