The Association Connecting Electronic Industries (IPC) has released two training DVDs on lead-free surface mount, one that covers surface mount rework and another looking at surface mount assembly.
DVD-67C, Lead-free surface mount rework, explains the differences between lead-free and tin-lead solder – for solder joint touch up and rework. It covers component removal, land preparation, component replacement and approved methods for touch up and rework with demonstrations of point-to-point soldering, drag soldering and touch up joints with too little solder bridges.
DVD-68C describes how the conversion to lead-free production affects the surface mount assembly process, including solder paste application, verification of lead-free components and circuit boards, special precautions for moisture sensitive devices, the effects of higher soldering temperatures on reflow/wave soldering operations and requirements for post-solder cleaning.
Both of the training programs discuss why companies are making the switch to lead-free processes, the characteristics of lead-free solder allows and lead-free solder joint evaluation comparing target acceptable and unacceptable lead-free joints with their tin-lead counterparts.