IPC and JEDEC are calling for speakers to participate in a global conference dedicated to addressing the issues of reliability and reliability of testing lead-free electronics. The conference will be held April 10 and 11 in Boston.
Presentations from environmental managers and technical staff are sought on subjects such as:
- Design for reliability (alloy selection, PCB FAB specification, moisture sensitivity)
- Processing (solderability, mixed solder alloys, assembly quality, repair/rework)
- Reliability )solder joints, PCB, components/packages/sockets, tin whiskers, product reliability estimation)
- Test (test strategies, failure acceleration methods, qualification procedures, solderability testing, drop/flex/thermal cycle/vibration/environmental testing, x-ray).
The conference offers time slots between 30 and 45 minutes. Some presenters may be grouped together in a forum or panel discussion. To submit an abstract, go to this form at the JEDEC website. The deadline for abstract submission is December 18.