The Center for Advanced Life Cycle Engineering will hold an International Symposium on Tin Whiskers April 25 – 25 at the University of Maryland. The symposium will cover whisker-related failure case histories, theories of tin whisker growth, experiments and results, risk evaluation and mitigation strategies. The goal is to offer attendees the current state of knowledge on the growth, risk and mitigation strategies of tin whisker growth.
The fear of tin whisker growth remains a thorn in the side of the push toward lead-free electronic parts. With the majority of component manufacturers now using pure tin or tin-rich lead-free alloys for terminals and finishes, experts in the electronics industry are deeply concerned about product failures due to whisker growth. In the past, a small percentage of lead mixed with tin in the solder and finishes mitigated whisker growth.
The deadline for presentation proposals is January 26. Accepted proposal presenters will be notified March 2. Deadline for attendance registration is April 2.