IPC will present the International Conference on Lead Free Materials and Surface Finishes on May 8 and 9 in San Jose, Calif. The conference is intended to help attendees address the materials and finish issues facing the electronics industry. Presenters will include representatives from companies that have implemented lead-free technology and have overcome the challenges involved in shifting to lead-free solder and finish surfaces.
The IPC conference with highlight the new base materials coming into the market and look at how these materials compare to existing materials and current industry specifications. In addition, presenters will look at curing agent changes, opportunities to improve resin systems and how Underwriters Laboratories’ approval fits into the shift to lead-free materials.
Attendees must register by April 13.
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