The Solder Products Value Council (IPVC) – formed recently by the Association Connecting Electronics Industries (IPC) – has launched a research program entitled, Take Action Limits (TAL). The program, headed by Karl Seelig, chairman of IPVC and VP of Technology at AIM Inc., and Paul Lotosky, technical committee chairman of IPVC and director of customer technical support at Cookson Electronics, seeks to provide consistent recommendations for action levels on contaminate of wave soldering alloys.
The SPVC is evaluating the effect of impurity limits on performance of lead-free solder by conducting wetting time and wetting force tests. In addition, samples will be sent to a third-party test facility to determine if a correlation exists between bridging and copper concentration.
“Take Action Limits, also know as ‘dump pot specifications,’ are very important to any electronics manufacturing company using flow soldering techniques either in selection soldering or wave soldering,” says Seelig. “Our objective is to develop better-defined limits to guide electronics manufacturers on a more efficient use of solder and as a result, improved yields.”
The SPVC plans to publish its findings and offer guidelines for solder pot management in the first quarter of 2008.