IPC and JEDEC will present the International Conference on Reliability, Rework, and Repair of Lead-Free Electronics on March 11-12 in Raleigh, N.C. The conference will address issues related to implementing a lead-free processes such as ally choices, component compatibility and solder concerns.
March 11 topics include:
IPC Lead-Free Acceptability Requirement for Electronic Assemblies by Dan Foster, STI Inc.
The Impact of Assembly, Rework, and Repair on the Reliability of PCB Interconnect Structures by Wener Engelmaier, Engelmaier Associates
Backward Compatibility by Denny Fritz, SAIC
Lead-Free Rework in a Mixed Alloy Environment by Kris Robertson, Best Inc.
Effect of Board and Package Attributes on Solder Joint Reliability of FCBGA
Quality Test Plan for Lead-Free Products
Base Material Selection for Reliable Lead-Free Processing
An Assessment of Lead-Free Printed Circuit Boards in High Sulfur Environments
Measuring Lead-Free Reliability of High Temperature Stabile Organic Solderability
March 12 topics will include education classes on lead-free rework, solder joint reliability interconnect failure and design reliability for plated-through holes.