The Surface Mount Technology Association will present an international conference on developing technology October 7 – 11 at the Gaylord Palms Resort and Convention Center in Orlando, Fla. The program will include more than 100 technical papers, 26 tutorials, an Evolving Technologies Summit and three focused symposia across six tracks, manufacturing and assembly; advanced packaging; substrates; soldering; process control; and contract manufacturing and business issues.
The Lead-Free Symposium will feature paper sessions on Solder Joint Reliability of SAC Alloy Variants, Lead-Free iNEMI Projects, Advances in Lead-Free Solder Joint Reliability, and Lead-Free Case Studies. Additionally, a plenary session will be held on a China RoHS Update. Also, a new Global RoHS Symposium will address the RoHS Revolution and Environmental Compliance.
The Evolving Technologies Summit will feature sessions on advanced materials, embedded chip packaging, and package interconnect reliability. The summit will conclude with an Evolving Technologies panel of experts from the user and supplier segments of the electronics industry.