Now that we’re six months past the RoHS deadline, IPC and Soldertec Global have scheduled a conference to examine compliance questions. The organizations have determined that many companies with high quality electronics products find that transferring to lead-free soldering production is not necessarily a piece of cake.
An IPC/Soldertec conference will be held in connection with the Dissemination Event by the European Union projects ELFNET, GREENROSE and LEADOUT. The conference will deliver results of more than three years high-level research into lead-free technologies.
The conference will be held in San Sebastian, Spain, on February 28 through March 2. Presentations related to RoHS will include a talk by Jean-Paul Clech who will give an in-depth review of “Lead-Free Solder Joint Reliability,” and Dr. Yoshiharu Kariya, active at the Shibaura Institute of Technology, who will present “Fatigue Characteristics of Lead-Free Solder Alloys.” A number of experts from Europe will also offer their perspectives on lead-free components.
For industrial control applications, or even a simple assembly line, that machine can go almost 24/7 without a break. But what happens when the task is a little more complex? That’s where the “smart” machine would come in. The smart machine is one that has some simple (or complex in some cases) processing capability to be able to adapt to changing conditions. Such machines are suited for a host of applications, including automotive, aerospace, defense, medical, computers and electronics, telecommunications, consumer goods, and so on. This discussion will examine what’s possible with smart machines, and what tradeoffs need to be made to implement such a solution.