As the world awaits commercialization of 0.18 micron- technology wafers, a University of Texas (Austin, TX) team led by Grant Willson printed 0.08 micron features on a semiconductor wafer using a 193-nm-wavelength stepper. The Semiconductor Industry Association's roadmap for the market did not expect 0.08 micron features until the year 2009. Experts predicted the development of a new post-optical technology to produce sizes at or below 0.10 micron. However, Willson generated the minute features using an etched-quartz phase-shift photomask produced by DuPont Photomasks Inc. (Round Rock, TX). "I didn't believe it could be done at first," says Willson. "It really works better than my wildest imaginings, and it appears that the process latitude is there to generate smaller features yet." Call (512) 471-7272.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Independent science safety company Underwriters Laboratories is providing new guidance for manufacturers about how to follow the latest IEC standards for implementing safety features in programmable logic controllers.
Automakers are adding greater digital capabilities to their design and engineering activities to promote collaboration among staff and suppliers, input consumer feedback, shorten product development cycles, and meet evolving end-use needs.
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