According to an extensive solder reliability study conducted by the Solder Products Value Council (SPVC), an IPC group, the tin/silver/copper (SAC) alloy family of lead-free solders is producing greater voids in the solder joint. Voids in solder joints are empty spaces within the joint that can be detected by X-ray imaging. Voids in SAC solders have been greater than 25 percent of the joint, a rejectable size for tin/lead solder joints.
The report notes, however, that the lead-free solders are reaching equivalency with the performance of tin/lead solders in spite of the larger voids. The report concludes, "there is no evidence that the type of solder joint voiding observed in SAC-alloy joints had any affect on solder joint reliability."
Safety networks have become more complex, and have actually become simpler and easier to deploy for plant operators. This slideshow highlights developments in plant safety with an emphasis on integrated safety networks.
As the MEMS industry spans a myriad of industries and markets, the future of MEMS in consumer electronics will enable a myriad of functionality, applications, and personalization.
The Nest is a sleek-looking digital thermostat which can actually "learn" its owners' schedule and then continue to regulate temperature to suit the user's preferences and patterns.
Thanks to embedded electronics, medical devices are getting smaller and smarter than ever. Pacemakers and implantable defibrillators are now able to call physicians. MRIs, CT scanners, and ultrasound machines are gaining mobility. And the venerable Band-Aid may soon be able to detect illnesses ranging from fevers to heart arrhythmias. On February 21, join Design News senior editor Charles Murray for a wide-ranging discussion, "Embedded Angles for Medical Products," which will explore the latest developments in medical electronics. The discussion will examine advances in medical device technology and offer an inside look at the embedded electronics behind it.
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