According to an extensive solder reliability study conducted by the Solder Products Value Council (SPVC), an IPC group, the tin/silver/copper (SAC) alloy family of lead-free solders is producing greater voids in the solder joint. Voids in solder joints are empty spaces within the joint that can be detected by X-ray imaging. Voids in SAC solders have been greater than 25 percent of the joint, a rejectable size for tin/lead solder joints.
The report notes, however, that the lead-free solders are reaching equivalency with the performance of tin/lead solders in spite of the larger voids. The report concludes, "there is no evidence that the type of solder joint voiding observed in SAC-alloy joints had any affect on solder joint reliability."
Last year at Hannover Fair, lots of people were talking about Industry 4.0. This is a concept that seems to have a different name in every region. I’ve been referring to it as the Industrial Internet of Things (IIoT), not to be confused with the plain old Internet of Things (IoT). Others refer to it as the Connected Industry, the smart factory concept, M2M, data extraction, and so on.
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