According to an extensive solder reliability study conducted by the Solder Products Value Council (SPVC), an IPC group, the tin/silver/copper (SAC) alloy family of lead-free solders is producing greater voids in the solder joint. Voids in solder joints are empty spaces within the joint that can be detected by X-ray imaging. Voids in SAC solders have been greater than 25 percent of the joint, a rejectable size for tin/lead solder joints.
The report notes, however, that the lead-free solders are reaching equivalency with the performance of tin/lead solders in spite of the larger voids. The report concludes, "there is no evidence that the type of solder joint voiding observed in SAC-alloy joints had any affect on solder joint reliability."
Are they robots or androids? We're not exactly sure. Each talking, gesturing Geminoid looks exactly like a real individual, starting with their creator, professor Hiroshi Ishiguro of Osaka University in Japan.
Truchard will be presented the award at the 2014 Golden Mousetrap Awards ceremony during the co-located events Pacific Design & Manufacturing, MD&M West, WestPack, PLASTEC West, Electronics West, ATX West, and AeroCon.
For industrial control applications, or even a simple assembly line, that machine can go almost 24/7 without a break. But what happens when the task is a little more complex? That’s where the “smart” machine would come in. The smart machine is one that has some simple (or complex in some cases) processing capability to be able to adapt to changing conditions. Such machines are suited for a host of applications, including automotive, aerospace, defense, medical, computers and electronics, telecommunications, consumer goods, and so on. This discussion will examine what’s possible with smart machines, and what tradeoffs need to be made to implement such a solution.