According to an extensive solder reliability study conducted by the Solder Products Value Council (SPVC), an IPC group, the tin/silver/copper (SAC) alloy family of lead-free solders is producing greater voids in the solder joint. Voids in solder joints are empty spaces within the joint that can be detected by X-ray imaging. Voids in SAC solders have been greater than 25 percent of the joint, a rejectable size for tin/lead solder joints.
The report notes, however, that the lead-free solders are reaching equivalency with the performance of tin/lead solders in spite of the larger voids. The report concludes, "there is no evidence that the type of solder joint voiding observed in SAC-alloy joints had any affect on solder joint reliability."
With major product releases coming from big names like Sony, Microsoft, and Samsung, and big investments by companies like Facebook, 2015 could be the year that virtual reality (VR) and augmented reality (AR) finally pop. Here's take a look back at some of the technologies that got us here (for better and worse).
Good engineering designs are those that work in the real world; bad designs are those that don’t. If we agree to set our egos aside and let the real world be our guide, we can resolve nearly any disagreement.
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