According to an extensive solder reliability study conducted by the Solder Products Value Council (SPVC), an IPC group, the tin/silver/copper (SAC) alloy family of lead-free solders is producing greater voids in the solder joint. Voids in solder joints are empty spaces within the joint that can be detected by X-ray imaging. Voids in SAC solders have been greater than 25 percent of the joint, a rejectable size for tin/lead solder joints.
The report notes, however, that the lead-free solders are reaching equivalency with the performance of tin/lead solders in spite of the larger voids. The report concludes, "there is no evidence that the type of solder joint voiding observed in SAC-alloy joints had any affect on solder joint reliability."
Fifty-six-year-old Pasquale Russo has been doing metalwork for more than 30 years in a tiny southern Italy village. Many craftsmen like him brought with them fabrication skills when they came from the Old World to America.
Linear guides are one of the most important components required for the design of automated or computer-controlled equipment. Aluminum profile extrusions, used for these guides, can enable designed-in functional features.
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