Agripper system for automatically handling tiny components, developed in the context of a Eureka project, uses the adhesive properties of ice to pick them up. The gripper first sprays a drop of water onto the object to be handled. It then closes in on the object. As soon as they touch, it freezes the water. The component can then be picked up and manipulated as necessary using the gripping strength of ice. This is around 1N/sq mm which is 20-100 times stronger than that obtained with vacuum grippers, says Mario El-Khoury, manager, industrial control at CSEM, the Swiss Centre for Electronics and Microtechnology, a partner in the European project. To release the object, the tip of the gripper is simply warmed up to the phase- change temperature of the liquid interface. The prototype version of Microgrip is capable of handling components measuring between 0.1 and 5 mm, with an accuracy of 1 micron, at a rate of 1,000 cycles per hour. The "ice" gripper is now undergoing industrialization by AP Technologies and Sysmelec, two other participants in the project. Meanwhile, El-Khoury's group is developing applications for the "ice" technology. A new Eureka project, in which Siemens and Philips are participants, will use Microgrip to manipulate micro-sized parts during low-distortion welding operations. For more information, call: Dr. Mario El-Khoury, at: +41-32- 720-55-96.
Samsung's Galaxy line of smartphones used to fare quite well in the repairability department, but last year's flagship S5 model took a tumble, scoring a meh-inducing 5/10. Will the newly redesigned S6 lead us back into star-studded territory, or will we sink further into the depths of a repairability black hole?
In 2003, the world contained just over 500 million Internet-connected devices. By 2010, this figure had risen to 12.5 billion connected objects, almost six devices per individual with access to the Internet. Now, as we move into 2015, the number of connected 'things' is expected to reach 25 billion, ultimately edging toward 50 billion by the end of the decade.
NASA engineer Brian Trease studied abroad in Japan as a high school student and used to fold fast-food wrappers into cranes using origami techniques he learned in library books. Inspired by this, he began to imagine that origami could be applied to building spacecraft components, particularly solar panels that could one day send solar power from space to be used on earth.
Biomedical engineering is one of the fastest growing engineering fields; from medical devices and pharmaceuticals to more cutting-edge areas like tissue, genetic, and neural engineering, US biomedical engineers (BMEs) boast salaries nearly double the annual mean wage and have faster than average job growth.
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