Deborah Chung, Ph.D., professor of mechanical and aerospace engineering at the University at Buffalo (Buffalo, NY), discovered semiconducting behavior from an unusual source: a carbon composite. Her work endows structural materials with electronic capabilities without computer chips or electrical leads. Chung says, "We can use the structural material itself as the electronics." Made from carbon fibers embedded in a polymer matrix, the material would be easier and less expensive to fabricate than traditional silicon-based electronics, says Chung. According to the researcher, the process spreads electronic capabilities over a large surface area, therefore heat dissipation--now one of the biggest technological challenges facing electronic packaging--would no longer be a problem. Chung's work was presented at the International Symposium on Smart Structures and Materials in San Diego on March 4. Call (716) 645-3811.
The Industrial Internet of Things may be going off the deep end in connecting everything on the plant floor. Some machines, bearings, or conveyors simply donít need to be monitored -- even if they can be.
Wind turbines already are imposing structures that stretch high into the sky, but an engineering graduate student at the University of Notre Dame wants to make them even taller to reduce energy costs and improve efficiency.
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