Deborah Chung, Ph.D., professor of mechanical and aerospace engineering at the University at Buffalo (Buffalo, NY), discovered semiconducting behavior from an unusual source: a carbon composite. Her work endows structural materials with electronic capabilities without computer chips or electrical leads. Chung says, "We can use the structural material itself as the electronics." Made from carbon fibers embedded in a polymer matrix, the material would be easier and less expensive to fabricate than traditional silicon-based electronics, says Chung. According to the researcher, the process spreads electronic capabilities over a large surface area, therefore heat dissipation--now one of the biggest technological challenges facing electronic packaging--would no longer be a problem. Chung's work was presented at the International Symposium on Smart Structures and Materials in San Diego on March 4. Call (716) 645-3811.
A quick look into the merger of two powerhouse 3D printing OEMs and the new leader in rapid prototyping solutions, Stratasys. The industrial revolution is now led by 3D printing and engineers are given the opportunity to fully maximize their design capabilities, reduce their time-to-market and functionally test prototypes cheaper, faster and easier. Bruce Bradshaw, Director of Marketing in North America, will explore the large product offering and variety of materials that will help CAD designers articulate their product design with actual, physical prototypes. This broadcast will dive deep into technical information including application specific stories from real world customers and their experiences with 3D printing. 3D Printing is