Deborah Chung, Ph.D., professor of mechanical and aerospace engineering at the University at Buffalo (Buffalo, NY), discovered semiconducting behavior from an unusual source: a carbon composite. Her work endows structural materials with electronic capabilities without computer chips or electrical leads. Chung says, "We can use the structural material itself as the electronics." Made from carbon fibers embedded in a polymer matrix, the material would be easier and less expensive to fabricate than traditional silicon-based electronics, says Chung. According to the researcher, the process spreads electronic capabilities over a large surface area, therefore heat dissipation--now one of the biggest technological challenges facing electronic packaging--would no longer be a problem. Chung's work was presented at the International Symposium on Smart Structures and Materials in San Diego on March 4. Call (716) 645-3811.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Independent science safety company Underwriters Laboratories is providing new guidance for manufacturers about how to follow the latest IEC standards for implementing safety features in programmable logic controllers.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies. You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived. So if you can't attend live, attend at your convenience.