Deborah Chung, Ph.D., professor of mechanical and aerospace engineering at the University at Buffalo (Buffalo, NY), discovered semiconducting behavior from an unusual source: a carbon composite. Her work endows structural materials with electronic capabilities without computer chips or electrical leads. Chung says, "We can use the structural material itself as the electronics." Made from carbon fibers embedded in a polymer matrix, the material would be easier and less expensive to fabricate than traditional silicon-based electronics, says Chung. According to the researcher, the process spreads electronic capabilities over a large surface area, therefore heat dissipation--now one of the biggest technological challenges facing electronic packaging--would no longer be a problem. Chung's work was presented at the International Symposium on Smart Structures and Materials in San Diego on March 4. Call (716) 645-3811.
At the Design News webinar on June 27, learn all about aluminum extrusion: designing the right shape so it costs the least, is simplest to manufacture, and best fits the application's structural requirements.
For industrial control applications, or even a simple assembly line, that machine can go almost 24/7 without a break. But what happens when the task is a little more complex? That’s where the “smart” machine would come in. The smart machine is one that has some simple (or complex in some cases) processing capability to be able to adapt to changing conditions. Such machines are suited for a host of applications, including automotive, aerospace, defense, medical, computers and electronics, telecommunications, consumer goods, and so on. This radio show will show what’s possible with smart machines, and what tradeoffs need to be made to implement such a solution.