CoroMill Series claims throughput gains of at least 30%. The secret: Fitting up to 14 different inserts to the same cutter body. The same cutter can provide light cutting power for aluminum to heavy roughing on cast steel.
Changing inserts, doesn't require presetting or running test cuts. Chip thickness generated on all edges is homogeneous. Several insert-clamping advances contribute to cutter versatility, stability and precision:
Inserts mounted in spring-loaded cassettes are clamped firmly in cutter body with a wedge.
Thick carbide shims protect both the cutter and insert for longer tool life. In the event of failure, only the shim, which costs far less than a cutter body, needs replacing.
Recessing the cassette-locking wedge screw into the wedge assists chip clearance, safe clamping and easy maintenance.
Locating pin limits setting ranges to provide maximum security, precision and safety within the total setting range.
Zero degree lead angle side- and face-mill machines slots, squares shoulders, cuts off, faces, backfaces, bores, and even makes holes. Serrations ensure radial and axial accuracy and repeatability of 0.0015 inch.
In support of customer demand and the industry's trend toward smaller, more compact designs, Texas Instruments (TI), Philips Semiconductors, and IDT (Integrated Device Technology Inc.) have agreed to source logic devices with the same functionality and pin-outs in space-saving, low-profile, fine-pitch ball grid array (LFBGA) packaging.
Compared with alternative types of packaging, the 0.8-mm ball pitch LFBGA logic package provides improved electrical and thermal performance. LFBGA reduces inductance by 45% compared to TSSOP packages. Small impedance variations between the package's pins results in a lower skew rate. Tests show the LFBGA package is up to 50% more efficient than TSSOP packages.
Space-constrained devices such as wireless telephone systems, base stations, networking systems, memory modules and hand-held computers are ideal applications for LFBGA logic devices.
TI Europe, SR Communications, attn: Soroya Johnson, Blackhorse Road, London SE8 5JH, UK. Ref event #SLL11001224E.
Because cable integrity on a suspension bridge is vital, it is important to know when strands break and how many are broken. These cable-strand break detectors contain an accelerometer and clip onto the bridge cables at intervals of 5 to 30m, depending on spacing of the roadway hangers.
When a strand breaks, the shock of it snapping produces a longitudinal wave with an amplitude of at least 1g. The first sensor detecting the shock wave signals other detectors along the line, increasing their sensitivity thresholds so that they can also detect the shock wave as it is attenuated along the cable. Analysis of the wave propagation using the signals received by a number of sensors enables localization of the break.
Accelerometer signals are filtered, amplified, and converted to digital signals for analysis. System needs about one month to assess background vibrations due to normal traffic flow before monitoring.
Samsung's Galaxy line of smartphones used to fare quite well in the repairability department, but last year's flagship S5 model took a tumble, scoring a meh-inducing 5/10. Will the newly redesigned S6 lead us back into star-studded territory, or will we sink further into the depths of a repairability black hole?
In 2003, the world contained just over 500 million Internet-connected devices. By 2010, this figure had risen to 12.5 billion connected objects, almost six devices per individual with access to the Internet. Now, as we move into 2015, the number of connected 'things' is expected to reach 25 billion, ultimately edging toward 50 billion by the end of the decade.
NASA engineer Brian Trease studied abroad in Japan as a high school student and used to fold fast-food wrappers into cranes using origami techniques he learned in library books. Inspired by this, he began to imagine that origami could be applied to building spacecraft components, particularly solar panels that could one day send solar power from space to be used on earth.
Biomedical engineering is one of the fastest growing engineering fields; from medical devices and pharmaceuticals to more cutting-edge areas like tissue, genetic, and neural engineering, US biomedical engineers (BMEs) boast salaries nearly double the annual mean wage and have faster than average job growth.
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