CoroMill Series claims throughput gains of at least 30%. The secret: Fitting up to 14 different inserts to the same cutter body. The same cutter can provide light cutting power for aluminum to heavy roughing on cast steel.
Changing inserts, doesn't require presetting or running test cuts. Chip thickness generated on all edges is homogeneous. Several insert-clamping advances contribute to cutter versatility, stability and precision:
Inserts mounted in spring-loaded cassettes are clamped firmly in cutter body with a wedge.
Thick carbide shims protect both the cutter and insert for longer tool life. In the event of failure, only the shim, which costs far less than a cutter body, needs replacing.
Recessing the cassette-locking wedge screw into the wedge assists chip clearance, safe clamping and easy maintenance.
Locating pin limits setting ranges to provide maximum security, precision and safety within the total setting range.
Zero degree lead angle side- and face-mill machines slots, squares shoulders, cuts off, faces, backfaces, bores, and even makes holes. Serrations ensure radial and axial accuracy and repeatability of 0.0015 inch.
In support of customer demand and the industry's trend toward smaller, more compact designs, Texas Instruments (TI), Philips Semiconductors, and IDT (Integrated Device Technology Inc.) have agreed to source logic devices with the same functionality and pin-outs in space-saving, low-profile, fine-pitch ball grid array (LFBGA) packaging.
Compared with alternative types of packaging, the 0.8-mm ball pitch LFBGA logic package provides improved electrical and thermal performance. LFBGA reduces inductance by 45% compared to TSSOP packages. Small impedance variations between the package's pins results in a lower skew rate. Tests show the LFBGA package is up to 50% more efficient than TSSOP packages.
Space-constrained devices such as wireless telephone systems, base stations, networking systems, memory modules and hand-held computers are ideal applications for LFBGA logic devices.
TI Europe, SR Communications, attn: Soroya Johnson, Blackhorse Road, London SE8 5JH, UK. Ref event #SLL11001224E.
Because cable integrity on a suspension bridge is vital, it is important to know when strands break and how many are broken. These cable-strand break detectors contain an accelerometer and clip onto the bridge cables at intervals of 5 to 30m, depending on spacing of the roadway hangers.
When a strand breaks, the shock of it snapping produces a longitudinal wave with an amplitude of at least 1g. The first sensor detecting the shock wave signals other detectors along the line, increasing their sensitivity thresholds so that they can also detect the shock wave as it is attenuated along the cable. Analysis of the wave propagation using the signals received by a number of sensors enables localization of the break.
Accelerometer signals are filtered, amplified, and converted to digital signals for analysis. System needs about one month to assess background vibrations due to normal traffic flow before monitoring.
When you think of the DARPA Robotics Challenge, you may imagine complex humanoid contraptions made of metal and wires that move like a Terminator Series T-90. But what actually happened at the much-vaunted event was something just a bit different.
Traditional dev kits are based on a manufacturer’s microcontroller, radio module, or sensor device. The idea is to aid the design engineer in developing his or her own IoT prototype as quickly as possible. A not-so-traditional IoT development kit released by Bosch aims to simplify IoT prototyping even further.
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