Sun Microsystems (San Jose, CA) isn't going to be left behind. The company developed a four-way embedded SPARC(TM) multiprocessor board, the Ultra AXmp, using Sun's new Computer Core Technology (CCT). CCT combines core system ASICs, memory, and SPARC CPUs in a modular package. "This is the first time this building-block approach has ever been done," says Sun's Jeff Veis. With a modular approach, people can pick any flavor of I/O they want and design accordingly. "CCT allows designers to get back in the game," he says. By partitioning the core components of Sun's four-way architecture in a dense and modular package, the company can offer three times the computer density or one-third the size of an average office system, while increasing the integration flexibility for the embedded market. The Ultra AXmp can be deployed in an industrial, rack-mount chassis in either a horizontal or vertical orientation. The board, specifically targeted for telecommunications and networking OEMs, will be available in the second half of 1998. Embedded configurations start at $7,500 in volume quantities. FAX: (408) 544-0180.
The transformative nature of designing and making things was the overarching, common theme at separate conferences held in Boston by two giants in the PLM space: Autodesk, with its Accelerate 2015, and Siemens’s Industry Analyst Conference 2015.
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