Sun Microsystems (San Jose, CA) isn't going to be left behind. The company developed a four-way embedded SPARC(TM) multiprocessor board, the Ultra AXmp, using Sun's new Computer Core Technology (CCT). CCT combines core system ASICs, memory, and SPARC CPUs in a modular package. "This is the first time this building-block approach has ever been done," says Sun's Jeff Veis. With a modular approach, people can pick any flavor of I/O they want and design accordingly. "CCT allows designers to get back in the game," he says. By partitioning the core components of Sun's four-way architecture in a dense and modular package, the company can offer three times the computer density or one-third the size of an average office system, while increasing the integration flexibility for the embedded market. The Ultra AXmp can be deployed in an industrial, rack-mount chassis in either a horizontal or vertical orientation. The board, specifically targeted for telecommunications and networking OEMs, will be available in the second half of 1998. Embedded configurations start at $7,500 in volume quantities. FAX: (408) 544-0180.
Engineers at Fuel Cell Energy have found a way to take advantage of a side reaction, unique to their carbonate fuel cell that has nothing to do with energy production, as a potential, cost-effective solution to capturing carbon from fossil fuel power plants.
This is part one of an article discussing the University of Washington’s nationally ranked FSAE electric car (eCar) and combustible car (cCar). Stay tuned for part two, tomorrow, which will discuss the four unique PCBs used in both the eCar and cCars.
Researchers working with additive manufacturing have said multimaterial techniques will allow industry “to fabricate materials with combinations of density, strength, and thermal expansion that do not exist [yet].”
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