Sun Microsystems (San Jose, CA) isn't going to be left behind. The company developed a four-way embedded SPARC(TM) multiprocessor board, the Ultra AXmp, using Sun's new Computer Core Technology (CCT). CCT combines core system ASICs, memory, and SPARC CPUs in a modular package. "This is the first time this building-block approach has ever been done," says Sun's Jeff Veis. With a modular approach, people can pick any flavor of I/O they want and design accordingly. "CCT allows designers to get back in the game," he says. By partitioning the core components of Sun's four-way architecture in a dense and modular package, the company can offer three times the computer density or one-third the size of an average office system, while increasing the integration flexibility for the embedded market. The Ultra AXmp can be deployed in an industrial, rack-mount chassis in either a horizontal or vertical orientation. The board, specifically targeted for telecommunications and networking OEMs, will be available in the second half of 1998. Embedded configurations start at $7,500 in volume quantities. FAX: (408) 544-0180.
With major product releases coming from big names like Sony, Microsoft, and Samsung, and big investments by companies like Facebook, 2015 could be the year that virtual reality (VR) and augmented reality (AR) finally pop. Here's take a look back at some of the technologies that got us here (for better and worse).
Good engineering designs are those that work in the real world; bad designs are those that don’t. If we agree to set our egos aside and let the real world be our guide, we can resolve nearly any disagreement.
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