Sun Microsystems (San Jose, CA) isn't going to be left behind. The company developed a four-way embedded SPARC(TM) multiprocessor board, the Ultra AXmp, using Sun's new Computer Core Technology (CCT). CCT combines core system ASICs, memory, and SPARC CPUs in a modular package. "This is the first time this building-block approach has ever been done," says Sun's Jeff Veis. With a modular approach, people can pick any flavor of I/O they want and design accordingly. "CCT allows designers to get back in the game," he says. By partitioning the core components of Sun's four-way architecture in a dense and modular package, the company can offer three times the computer density or one-third the size of an average office system, while increasing the integration flexibility for the embedded market. The Ultra AXmp can be deployed in an industrial, rack-mount chassis in either a horizontal or vertical orientation. The board, specifically targeted for telecommunications and networking OEMs, will be available in the second half of 1998. Embedded configurations start at $7,500 in volume quantities. FAX: (408) 544-0180.
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A quick look into the merger of two powerhouse 3D printing OEMs and the new leader in rapid prototyping solutions, Stratasys. The industrial revolution is now led by 3D printing and engineers are given the opportunity to fully maximize their design capabilities, reduce their time-to-market and functionally test prototypes cheaper, faster and easier. Bruce Bradshaw, Director of Marketing in North America, will explore the large product offering and variety of materials that will help CAD designers articulate their product design with actual, physical prototypes. This broadcast will dive deep into technical information including application specific stories from real world customers and their experiences with 3D printing. 3D Printing is
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