Pacific Northwest National Laboratory is teaming with Sematech (Austin, TX) to develop a new material for the next generation of high-performance semiconductor devices, including advanced microprocessors. Through the $1.5 million project, collaborators will investigate mesoporous silica as an improved insulating material between metal conduction lines on semiconductor chips. The material, porous and uniform in structure, can be formed into thin films, potentially resulting in semiconductor devices that operate at much higher speeds, while consuming less power. Researchers at Pacific Northwest estimate that the new material should result in significant savings in fabrication costs, up to $500 million annually. FAX: (509) 375-2242.
One way to keep a Formula One racing team moving at breakneck speed in the pit and at the test facility is to bring CAD drawings of the racing vehicleís parts down to the test facility and even out to the track.
Most of us would just as soon step on a cockroach rather than study it, but thatís just what researchers at UC Berkeley did in the pursuit of building small, nimble robots suitable for disaster-recovery and search-and-rescue missions.
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