Pacific Northwest National Laboratory is teaming with Sematech (Austin, TX) to develop a new material for the next generation of high-performance semiconductor devices, including advanced microprocessors. Through the $1.5 million project, collaborators will investigate mesoporous silica as an improved insulating material between metal conduction lines on semiconductor chips. The material, porous and uniform in structure, can be formed into thin films, potentially resulting in semiconductor devices that operate at much higher speeds, while consuming less power. Researchers at Pacific Northwest estimate that the new material should result in significant savings in fabrication costs, up to $500 million annually. FAX: (509) 375-2242.
Most machine design engineers will survey existing component manufacturers for standard linear guide products, limiting what they can do with their designs. Using extruded aluminum profile guides can customize machine designs while shrinking the bill of materials.
Weaned on the relatively effortless connectivity of today’s massive variety of consumer electronic products, automation users in the IIoT will likely not tolerate too many competing, piecemeal standards for long. And the Industrial Internet Consortium is trying to preempt history.
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