Pacific Northwest National Laboratory is teaming with Sematech (Austin, TX) to develop a new material for the next generation of high-performance semiconductor devices, including advanced microprocessors. Through the $1.5 million project, collaborators will investigate mesoporous silica as an improved insulating material between metal conduction lines on semiconductor chips. The material, porous and uniform in structure, can be formed into thin films, potentially resulting in semiconductor devices that operate at much higher speeds, while consuming less power. Researchers at Pacific Northwest estimate that the new material should result in significant savings in fabrication costs, up to $500 million annually. FAX: (509) 375-2242.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
Independent science safety company Underwriters Laboratories is providing new guidance for manufacturers about how to follow the latest IEC standards for implementing safety features in programmable logic controllers.
Automakers are adding greater digital capabilities to their design and engineering activities to promote collaboration among staff and suppliers, input consumer feedback, shorten product development cycles, and meet evolving end-use needs.
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