Pacific Northwest National Laboratory is teaming with Sematech (Austin, TX) to develop a new material for the next generation of high-performance semiconductor devices, including advanced microprocessors. Through the $1.5 million project, collaborators will investigate mesoporous silica as an improved insulating material between metal conduction lines on semiconductor chips. The material, porous and uniform in structure, can be formed into thin films, potentially resulting in semiconductor devices that operate at much higher speeds, while consuming less power. Researchers at Pacific Northwest estimate that the new material should result in significant savings in fabrication costs, up to $500 million annually. FAX: (509) 375-2242.
When you think of the DARPA Robotics Challenge, you may imagine complex humanoid contraptions made of metal and wires that move like a Terminator Series T-90. But what actually happened at the much-vaunted event was something just a bit different.
Traditional dev kits are based on a manufacturer’s microcontroller, radio module, or sensor device. The idea is to aid the design engineer in developing his or her own IoT prototype as quickly as possible. A not-so-traditional IoT development kit released by Bosch aims to simplify IoT prototyping even further.
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