ELECTRONICS: Molex Incorporated announced the release of two additions to its Mini-Fit product line. Both products meet the high-current and high-density standards found in the Mini-Fit family and are ideal for a wide range of industries and applications including telecommunications, medical, industrial equipment, personal computers and power supplies. Other product details include:
Mini-Fit Plus HCSä (High Current System) Terminal: The patented Mini-Fit Plus HCS terminals allow customers to increase their current loads by an additional 3.0A per circuit. With a unique, elliptical contact dimple designed to increase durability and gold plate terminals, which allow for an increased number of mating cycles and are suitable for hot-pluggable applications, this family extension allows for increased performance, without changing footprint layout or existing tooling. These terminals are designed to be used with all existing Mini-Fit receptacle housings.
The Mini-Fit RTCä (Reflow Temperature Compatible) Headers: Designed with a high-temperature LCP housing, Mini-Fit RTC headers can withstand solder-reflow temperatures of up to 265C, guaranteeing compatibility with lead-free reflow processes. The headers mate with standard Mini-Fit receptacles and incorporate a standard polarization design. They also share the same design features with the rest of the Mini-Fit family, ensuring compatibility and reliability.
The new products also share other core attributes of the Mini-Fit family including being UL recognized, CSA approved, TUV licensed, lead-free and RoHS compliant.
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