SOFTWARE/HARDWARE: Engineering Technology Associates Inc. announces the introduction of the INC Solver, an explicit finite element analysis (FEA) solver designed for sheet metal forming simulations. This virtual tryout tool for die face design expands the usability of ETA’s latest edition of DYNAFORM’s Die Face Engineering (DFE) module, version 5.7.3, which was released this March. INC Solver provides a value solution for customers who are looking for an easy-to-master rapid die design and virtual tryout tool that generates quick results without sacrificing accuracy.
Utilizing the latest multiple-core computing platform from Intel, INC Solver is compatible with the Microsoft Windows platform, using a Shared Memory Processing (SMP) scheme and multiple-core CPUs.
Simulation setup is quick and efficient, yet robust, with fine-tuned parameters for optimal results. INC Solver supports non-conforming CAD surfaces, which eliminates the need for mesh repair, and utilizes a simultaneous fusion-fission approach to handle mesh adaptivity. For die face design virtual tryout, the solver offers capabilities for simulating gravity-loading, binder-wrap, crash-form, single-action and double-action draw die, as well as spring back prediction and lancing operations.
INC Solver takes advantage of Intel’s latest multiple-core computing platform to make computing very affordable. For example, a 4-Core system costing under $1,500 can process the most complicated large bodyside panel simulation in less than 50 minutes.
In addition to DFE, DYNAFORM consists of three other modules including Blank Size Engineering (BSE), LS-DYNA-based Formability Simulation (FS) and LS-DYNA-based Die System Analysis (DSA). DYNAFORM is a complete die system simulation solution which allows organizations to bypass soft tooling, reducing overall user qualification thresholds and tryout time, lowering costs, increasing cycle times and productivity, and providing confidence in die system design.
-Edited by Kelsey Anderson