SENSORS: All Sensors Corp. announced the introduction of low pressure sensor die for high volume applications requiring pressure measurement to as low as a quarter inch of water full scale. This introduction of a new pressure sensor die marks the fifth major silicon pressure sensor die topology to be introduced over the past fifty years.
The MEMS Piezoresistive Low Pressure Sensing Die utilizes an open bridge configuration, measuring 2mm x 2mm sq. Industry best sensitivity specifications are made possible by break though process technology in combination with innovative MEMS topology. The new die design features maximum pressure response while maintaining low package stress susceptibility. By utilizing a boss-less structure the position sensitivity is minimized (typically 0.1 percent inH2O/g).
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Contact factory for price. Samples are currently available for product testing.
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