MATERIALS: Master Bond Inc’s Master Bond EP21FL is a two-part epoxy resin system that features low to moderate viscosity. It is well-suited for potting, coating and sealing electronic assemblies and excels at bonding dissimilar substrates with different coefficients of expansion. This high-performance adhesive has a wide service temperature range of -60 to 250F.
The typical viscosity of Part A is 4,000 cps at 25C and 10,000 cps at 25C for Part B. This system produces high-strength castings, bonds and seals that are resistant to thermal cycling and shock. Its bond strength is generally greater than 1,500 psi and its tensile strength normally exceeds 1,100 psi.
The hardened compound is an electrical insulator with a volume resistivity greater than 1012 Ω-cm. As a flexibilized system, it is characterized by superior impact and chemical resistance.
EP21FL is available in half pint, pint, quart, 1 gal and 5 gal container kits.
-Edited by Kelsey Anderson