ELECTRONICS:Tyco Electronics’ new surface mount rPGA sockets are designed to support Intel® CoreTM i7 989 and 988 mobile processors, and are validated to Intel design guides for high-performance and extreme mobile products.
The sockets were designed with pin count patterns of 989 or 988 contact positions to ensure proper alignment of the processor to the socket. Contacts are arranged on a symmetrical grid of 1.0 x 1.0 mm spacing. The sockets — each with a screw-activated cam— are equipped with solder balls for direct printed circuit board (PCB) attachment. Placement of the processor into the socket and turning the screw secures the processor in its mated position. For automated pick-and-place, removable caps are supplied.
Specific product application includes CPUs used in notebook computers that require low-profile surface mount interconnects. The socket height after reflow is 3 mm.
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