ELECTRONICS: Molex Inc. recently announced a new addition to the EdgeLineTM family of connectors. The EdgeLine CoEdge Connector, which was recently nominated as a DesignVision finalist at the upcoming DesignCon 2010 show, is a one-piece, 25 Gbps connector that is configured to meet an industry standard pitch of 0.80 mm (.031 inch). This low-profile, dual-sided, edgecard connector supports sixteen PCB thickness variations with multiple circuit sizes for high-speed, industry-standard, edgecard applications.CoEdge connectors ensure PCBs are aligned at the centerline to allow for a uniform signal path across the length of the connector. Keying and locking features are provided to secure the connector to the PCB and improve board alignment during mating. Application tooling is not needed, allowing for easy board installation.
The company says it anticipates high-definition video for home security and other uses will be the next mature technology integrated into the IoT domain, hence the introduction of its MatrixCam devkit.
Siemens and Georgia Institute of Technology are partnering to address limitations in the current additive manufacturing design-to-production chain in an applied research project as part of the federally backed America Makes program.
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