ELECTRONICS: Molex Inc. recently announced a new addition to the EdgeLineTM family of connectors. The EdgeLine CoEdge Connector, which was recently nominated as a DesignVision finalist at the upcoming DesignCon 2010 show, is a one-piece, 25 Gbps connector that is configured to meet an industry standard pitch of 0.80 mm (.031 inch). This low-profile, dual-sided, edgecard connector supports sixteen PCB thickness variations with multiple circuit sizes for high-speed, industry-standard, edgecard applications.CoEdge connectors ensure PCBs are aligned at the centerline to allow for a uniform signal path across the length of the connector. Keying and locking features are provided to secure the connector to the PCB and improve board alignment during mating. Application tooling is not needed, allowing for easy board installation.
Researchers working with additive manufacturing have said multimaterial techniques will allow industry “to fabricate materials with combinations of density, strength, and thermal expansion that do not exist [yet].”
The term "multiphysics" is used to describe the simulation of multiple types of physics and their influence on one another -- for example, the investigation of the behavior of a chemical in liquid form will involve both chemistry and fluid dynamics.
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