ELECTRONICS: FCI’s High Power Card Edge (HPCETM) connector is a next generation power card edge connector intended for applications demanding low power loss and high linear current density. The connector is rated to 9A per power contact beam (with multiple power contacts fully energized) without exceeding a 30C temperature rise in still air. The HPCE connector has a low profile height (<= 7.50 mm) and is based on very cost-effective and highly reliable stamped-and-formed power contact technology.
HPCE connectors are available with power and signal contacts integrated into a single molded housing for power distribution and power control. The flexible, modular tooling approach used for the HPCE connector makes the product highly configurable in terms of the number and placement of the power and signal contacts for custom power needs.The HPCE connector features a low profile height for increased system airflow and heat dissipation, low contact resistance characteristics, significantly increased linear current density, a robust housing with touch-proof safety features and a polarization option to ensure proper mating. Vertical and right-angle options are available to accommodate various system architectures.
Robots that walk have come a long way from simple barebones walking machines or pairs of legs without an upper body and head. Much of the research these days focuses on making more humanoid robots. But they are not all created equal.
The IEEE Computer Society has named the top 10 trends for 2014. You can expect the convergence of cloud computing and mobile devices, advances in health care data and devices, as well as privacy issues in social media to make the headlines. And 3D printing came out of nowhere to make a big splash.
For industrial control applications, or even a simple assembly line, that machine can go almost 24/7 without a break. But what happens when the task is a little more complex? That’s where the “smart” machine would come in. The smart machine is one that has some simple (or complex in some cases) processing capability to be able to adapt to changing conditions. Such machines are suited for a host of applications, including automotive, aerospace, defense, medical, computers and electronics, telecommunications, consumer goods, and so on. This discussion will examine what’s possible with smart machines, and what tradeoffs need to be made to implement such a solution.