MATERIALS: Fujipoly introduces Sarcon® GR-Ae, an extremely soft Thermal Interface Silicone Gel Compound. Sarcon® GR-Ae is manufactured in sheet form and is designed to efficiently transfer heat from its source to a nearby heat sink. The unique physical properties of this material make it ideal for filling air gaps between delicate and uneven components.This high-performance gap filler compound offers a thermal conductivity of 1.3 W/m°K with a thermal resistance as low as .43 °Cin2/W. The gap filler pad is available in thicknesses ranging from 0.5 to 5.0mm. Sarcon® GR-Ae can be ordered in sheets up to 200 mm x 300 mm or die-cut to your exact application specifications.
In a line of ultra-futuristic projects, DARPA is developing a brain microchip that will help heal the bodies and minds of soldiers. A final product is far off, but preliminary chips are already being tested.
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