ELECTRONICS: Molex Inc. continues its commitment to delivering ground-breaking technologies that meet the growing need for ever-faster network transmissions. As the global demand for more advanced, high speed networks continues to grow, the company is focused on designing and developing solutions that help its customers meet the challenge. Molex’s products and solutions are used in high-speed applications by companies in a wide range of industries including telecommunications, data/communications, networking/servers/storage, industrial, medical and military/aerospace.
The widespread growth of high-speed and broadband systems has introduced unique signal integrity issues. These networks require closely coupled high-speed links, which introduce noise, crosstalk and signal degradation. The problem is magnified over longer links in backplanes, cables and PCB materials. Finding effective solutions is a fundamental need in building reliable communications equipment and Molex provides complete electrical evaluation and testing for the initial design and ongoing support of all their customers’ signal integrity needs.
The company has responded to customer demands for smaller and faster solutions and recently unveiled several products that meet the high-speed, high-density, high-signal-integrity needs for virtually any application, including:
ImpactTM Backplane Connector System: The Impact Backplane Connector System’s broad-edge-coupled transmission technology enables low cross talk and high signal bandwidth while minimizing channel-performance variation across every differential pair within the system. It provides data rates of over 25 Gbps, superior signal density and flexible configurations including the recently introduced CoPlanar Connector System and Mezzanine Connector System. Both meet the demands of the next-generation telecommunications and data networking market by allowing customers to optimize their designs for superior mechanical and electrical performance.
EdgeLineTM CoEdgeTM Connector (DesignVision Finalist): The Edgeline CoEdge Connector is a one-piece, 25 Gbps edgecard-to-edgecard connector that is configured to meet an industry standard pitch of 0.80mm (.031″). This low-profile, dual-sided, edgecard connector supports sixteen PCB thickness variations with multiple circuit sizes for high-speed, scalable solutions in low-to-mid range telecom, computing and storage applications.
iPass+TM High Density (HD) Connector: The iPass+TM High Density (HD) I/O system offers connectors and cables that enable flexible-speed compatibility for applications ranging up to 12 Gbps. This ideal solution for the growing server-storage market was chosen by the INCITS T10 Standards Committee as their next generation I/O interface. iPass+TM HD features a unique multi-plugging capability that enables either individual 4x or unitized 8x plugs to mate to the same 2 or 4 port host board receptacle.
Molex will be showcasing its high-speed products and solutions at DesignCon, Booth 509, Feb.2 and 3, 2010.
Robots that walk have come a long way from simple barebones walking machines or pairs of legs without an upper body and head. Much of the research these days focuses on making more humanoid robots. But they are not all created equal.
The IEEE Computer Society has named the top 10 trends for 2014. You can expect the convergence of cloud computing and mobile devices, advances in health care data and devices, as well as privacy issues in social media to make the headlines. And 3D printing came out of nowhere to make a big splash.
For industrial control applications, or even a simple assembly line, that machine can go almost 24/7 without a break. But what happens when the task is a little more complex? That’s where the “smart” machine would come in. The smart machine is one that has some simple (or complex in some cases) processing capability to be able to adapt to changing conditions. Such machines are suited for a host of applications, including automotive, aerospace, defense, medical, computers and electronics, telecommunications, consumer goods, and so on. This discussion will examine what’s possible with smart machines, and what tradeoffs need to be made to implement such a solution.