ELECTRONICS:Molex Inc. has released two additions to the ImpactTM Backplane Connector System, its high-speed, high-density connector system for the telecommunication and data networking market. The Impact CoPlanar Connector System and Impact Mezzanine Connector System provide the ultimate flexibility to optimize designs for superior mechanical and electrical performance. Both products will be demonstrated by Molex in booth 509 at DesignCon, Feb. 2-3, Santa Clara, CA.
The Impact Backplane Connector System is available in two- to six-pair configurations with a complete range of guidance and power solution options. It provides data rates up to 25 Gbps and superior signal density up to 80 differential pairs per inch.The Impact system’s broad-edge-coupled transmission technology enables low cross talk and high signal bandwidth while minimizing channel-performance variation across every differential pair within the system. In addition to sharing these features, the two new products provide the following:
Impact CoPlanar Connector System: Available in multiple compliant-pin design options on both right angle male and right angle female connectors. The system’s mating interface provides in-line staggered, bifurcated contacts that provide 2 points of contact for long-term reliability performance and built-in, ground-signal sequencing. This reduces the average mating force per connector to improve the mechanical mating performance of the system.
Impact Mezzanine Connector System: An end-to-end stackable solution utilizes Impact leadframe and backplane header technologies for superior electrical performance. Impact 5 pair mezzanine allows 67 differential pairs per linear inch and provides data rates up to 25 Gbps. The current stacking height is 40 mm, but can be customized to heights between 18 and 40 mm. Impact 5 pair power solutions are part of the product line, featuring 100A per module and four discrete power lines per module, aligning to our 40 mm stack height
The transformative nature of designing and making things was the overarching, common theme at separate conferences held in Boston by two giants in the PLM space: Autodesk, with its Accelerate 2015, and Siemens’s Industry Analyst Conference 2015.
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