ELECTRONICS:Molex Inc. has released two additions to the ImpactTM Backplane Connector System, its high-speed, high-density connector system for the telecommunication and data networking market. The Impact CoPlanar Connector System and Impact Mezzanine Connector System provide the ultimate flexibility to optimize designs for superior mechanical and electrical performance. Both products will be demonstrated by Molex in booth 509 at DesignCon, Feb. 2-3, Santa Clara, CA.
The Impact Backplane Connector System is available in two- to six-pair configurations with a complete range of guidance and power solution options. It provides data rates up to 25 Gbps and superior signal density up to 80 differential pairs per inch.The Impact system’s broad-edge-coupled transmission technology enables low cross talk and high signal bandwidth while minimizing channel-performance variation across every differential pair within the system. In addition to sharing these features, the two new products provide the following:
Impact CoPlanar Connector System: Available in multiple compliant-pin design options on both right angle male and right angle female connectors. The system’s mating interface provides in-line staggered, bifurcated contacts that provide 2 points of contact for long-term reliability performance and built-in, ground-signal sequencing. This reduces the average mating force per connector to improve the mechanical mating performance of the system.
Impact Mezzanine Connector System: An end-to-end stackable solution utilizes Impact leadframe and backplane header technologies for superior electrical performance. Impact 5 pair mezzanine allows 67 differential pairs per linear inch and provides data rates up to 25 Gbps. The current stacking height is 40 mm, but can be customized to heights between 18 and 40 mm. Impact 5 pair power solutions are part of the product line, featuring 100A per module and four discrete power lines per module, aligning to our 40 mm stack height
Truchard will be presented the award at the 2014 Golden Mousetrap Awards ceremony during the co-located events Pacific Design & Manufacturing, MD&M West, WestPack, PLASTEC West, Electronics West, ATX West, and AeroCon.
Robots that walk have come a long way from simple barebones walking machines or pairs of legs without an upper body and head. Much of the research these days focuses on making more humanoid robots. But they are not all created equal.
The IEEE Computer Society has named the top 10 trends for 2014. You can expect the convergence of cloud computing and mobile devices, advances in health care data and devices, as well as privacy issues in social media to make the headlines. And 3D printing came out of nowhere to make a big splash.
For industrial control applications, or even a simple assembly line, that machine can go almost 24/7 without a break. But what happens when the task is a little more complex? That’s where the “smart” machine would come in. The smart machine is one that has some simple (or complex in some cases) processing capability to be able to adapt to changing conditions. Such machines are suited for a host of applications, including automotive, aerospace, defense, medical, computers and electronics, telecommunications, consumer goods, and so on. This discussion will examine what’s possible with smart machines, and what tradeoffs need to be made to implement such a solution.