ELECTRONICS: Bomar Interconnect Products Inc. recently announced the release of the A-lignTM Series of multi-port MMCX antenna RF connectors. Initially consisting of three- and six-port parts, the proprietary A-lign Series is engineered to support the wireless sector’s demand for increasingly smaller consumer, industrial and commercial products. Designed for high-density, cable-to-board applications, the 5.00 mm (1.97 inch) centerline parts provide OEMs/ODMs with the ultimate solution for ensuring the integrity of coaxial cable connections, especially where PCBs are stacked. Moreover, their employment reduces manufacturers’ BOM while optimizing close proximity alignment to help speed products’ time-to-market. The A-lign Series meets or exceeds all industry mechanical, electrical, and environmental standards.These PCB mount coaxial interconnects are ideally suited for the broadest range of compact, high-density wireless applications in which package size and high performance are critical factors. They are most frequently specified in cellular base stations, test and measurement equipment, and medical equipment. Both male and female devices are provided with snap-together coupling to facilitate low RF leakage and ease of assembly. Female parts featuring Bomar’s E-SnapTM PC mounting technology are optionally available. These connectors notably do not require an adhesive prior to reflow soldering as they “snap” securely into previously solder-pasted holes for reflow soldering.
Devices feature a 50-ohm impedance and repeatable performance to 6 GHz. A-Lign interconnects are manufactured of precision-machined brass with gold bodies to support an extremely low reflection factor with a VSWR of 1.30. Female interconnects are provided with gold-plated, beryllium/copper contacts. All parts are supplied with a Teflon dielectric to facilitate a low dielectric constant and for reflow soldering. While interconnects are supplied standard with 5.00 mm centerlines, custom centerline dimensions are accommodated.
Robots that walk have come a long way from simple barebones walking machines or pairs of legs without an upper body and head. Much of the research these days focuses on making more humanoid robots. But they are not all created equal.
The IEEE Computer Society has named the top 10 trends for 2014. You can expect the convergence of cloud computing and mobile devices, advances in health care data and devices, as well as privacy issues in social media to make the headlines. And 3D printing came out of nowhere to make a big splash.
For industrial control applications, or even a simple assembly line, that machine can go almost 24/7 without a break. But what happens when the task is a little more complex? That’s where the “smart” machine would come in. The smart machine is one that has some simple (or complex in some cases) processing capability to be able to adapt to changing conditions. Such machines are suited for a host of applications, including automotive, aerospace, defense, medical, computers and electronics, telecommunications, consumer goods, and so on. This discussion will examine what’s possible with smart machines, and what tradeoffs need to be made to implement such a solution.