MATERIALS: Fujipoly’s SARCON SPG-30A is a newly developed high viscosity, thermal interface silicone compound that is designed to efficiently transfer heat from a board-level source to a heat sink or heat spreader. This high-performance material offers a thermal conductivity of 3.2 W/m°K and provides superior handling characteristics compared to traditional thermal grease and potting materials. The product also offers a new thermal management option for electronic devices that operate at higher frequencies.SARCON® SPG-30A exhibits near-zero compression force and easily conforms to all component shapes and sizes. These characteristics make SPG-30A ideal for filling large gaps around fragile circuit board solder points without causing damage or loss in performance. The form stable thermal compound requires no heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range (-40 to 150C).
Fujipoly’s new SARCON® SPG-30A material is available in 30cc tubes, 330cc cartridges and 10L pails.
Most machine design engineers will survey existing component manufacturers for standard linear guide products, limiting what they can do with their designs. Using extruded aluminum profile guides can customize machine designs while shrinking the bill of materials.
Weaned on the relatively effortless connectivity of today’s massive variety of consumer electronic products, automation users in the IIoT will likely not tolerate too many competing, piecemeal standards for long. And the Industrial Internet Consortium is trying to preempt history.
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