MATERIALS: Fujipoly’s SARCON SPG-30A is a newly developed high viscosity, thermal interface silicone compound that is designed to efficiently transfer heat from a board-level source to a heat sink or heat spreader. This high-performance material offers a thermal conductivity of 3.2 W/m°K and provides superior handling characteristics compared to traditional thermal grease and potting materials. The product also offers a new thermal management option for electronic devices that operate at higher frequencies.SARCON® SPG-30A exhibits near-zero compression force and easily conforms to all component shapes and sizes. These characteristics make SPG-30A ideal for filling large gaps around fragile circuit board solder points without causing damage or loss in performance. The form stable thermal compound requires no heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range (-40 to 150C).
Fujipoly’s new SARCON® SPG-30A material is available in 30cc tubes, 330cc cartridges and 10L pails.
The transformative nature of designing and making things was the overarching, common theme at separate conferences held in Boston by two giants in the PLM space: Autodesk, with its Accelerate 2015, and Siemens’s Industry Analyst Conference 2015.
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