MATERIALS: Fujipoly’s SARCON SPG-30A is a newly developed high viscosity, thermal interface silicone compound that is designed to efficiently transfer heat from a board-level source to a heat sink or heat spreader. This high-performance material offers a thermal conductivity of 3.2 W/m°K and provides superior handling characteristics compared to traditional thermal grease and potting materials. The product also offers a new thermal management option for electronic devices that operate at higher frequencies.SARCON® SPG-30A exhibits near-zero compression force and easily conforms to all component shapes and sizes. These characteristics make SPG-30A ideal for filling large gaps around fragile circuit board solder points without causing damage or loss in performance. The form stable thermal compound requires no heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range (-40 to 150C).
Fujipoly’s new SARCON® SPG-30A material is available in 30cc tubes, 330cc cartridges and 10L pails.
Most cyber attacks could be avoided by adopting a list of Critical Security Controls that were created by the Center for Internet Security. Thatís the message from Steve Mustard of the Automation Federation.
George Leopold's talk at last week's Design & Manufacturing Minneapolis helped restore astronaut and engineer Gus Grissom's role in the beginnings of NASA, and outlined how Grissom played a pivotal role in winning the Space Race.
Focus on Fundamentals consists of 45-minute on-line classes that cover a host of technologies.
You learn without leaving the comfort of your desk. All classes are taught by subject-matter experts and all are archived.
So if you can't attend live, attend at your convenience.