MATERIALS: Fujipoly’s SARCON SPG-30A is a newly developed high viscosity, thermal interface silicone compound that is designed to efficiently transfer heat from a board-level source to a heat sink or heat spreader. This high-performance material offers a thermal conductivity of 3.2 W/m°K and provides superior handling characteristics compared to traditional thermal grease and potting materials. The product also offers a new thermal management option for electronic devices that operate at higher frequencies.SARCON® SPG-30A exhibits near-zero compression force and easily conforms to all component shapes and sizes. These characteristics make SPG-30A ideal for filling large gaps around fragile circuit board solder points without causing damage or loss in performance. The form stable thermal compound requires no heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range (-40 to 150C).
Fujipoly’s new SARCON® SPG-30A material is available in 30cc tubes, 330cc cartridges and 10L pails.
The Internet happened.” Those three words spoken yesterday by Marc Ostertag, North America president of B&R Automation at Pacific Design & Manufacturing, now taking place in Anaheim through Feb. 11, continues to bring ever-lasting changes to our ways of life and will undoubtedly transform manufacturing.
When you think of the DARPA Robotics Challenge, you may imagine complex humanoid contraptions made of metal and wires that move like a Terminator Series T-90. But what actually happened at the much-vaunted event was something just a bit different.
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