FLUID POWER: The Lee Co.’s new atomizing nozzles, available in both airless and air assisted styles, generate a 50 degree hollow cone spray pattern and offer precise, controlled atomization in a compact package. The airless atomizing nozzles do not need an external air supply and will atomize with pressures as low as 15 psi (on water). The air-assisted nozzles utilize an external air source to control the atomization, allowing lower operating pressures (as low as 5 psi). The nozzles are compatible with Lee’s 062 MINSTAC fitting system and Lee’s VHS micro-dispense valves for fine flow rate control using pulse width modulation (PWM).
One of the biggest walls in embedded software development is the integration of low-level drivers with higher-level middleware and application code, but silicon vendors are stepping up to bring it down.
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