MATERIALS: Master Bond has introduced a thermal adhesive film called FL901AO. It is formulated to function as the preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices. The 100 percent solid, B-stage adhesive-preform provides a high bond strength, no-mess solution to electronic assembly and other industrial bonding and sealing operations. An attractive characteristic of the FL901AO epoxy preform is its ability to cure quickly at quite moderate temperatures, e.g. 1 hour at 250F (125C) or 30-40 minutes at 300F (150C). Also, squeeze out during bonding is almost non-existent. While FL901AO exhibits a thermal conductivity on a level of 10 BTU•in/ft²hrF, it is highly electrically insulating, with volume resistivity exceeding 101012 ohm-cm. The properties of FL901AO are substantially maintained over a wide temperature range from -100 to 400F and upon prolonged exposure to harsh environmental conditions such as moisture, heat and other chemicals. It also features outstanding resistance to thermal shock, vibration and impact.Master Bond’s FL901AO film preform is available in a range of film thicknesses and can be laser or die cut to the configuration of any part. Master Bond also offers the extra service of applying the preformed epoxy film directly onto parts and then returning them to the end user for assembly.
Robots that walk have come a long way from simple barebones walking machines or pairs of legs without an upper body and head. Much of the research these days focuses on making more humanoid robots. But they are not all created equal.
The IEEE Computer Society has named the top 10 trends for 2014. You can expect the convergence of cloud computing and mobile devices, advances in health care data and devices, as well as privacy issues in social media to make the headlines. And 3D printing came out of nowhere to make a big splash.
For industrial control applications, or even a simple assembly line, that machine can go almost 24/7 without a break. But what happens when the task is a little more complex? That’s where the “smart” machine would come in. The smart machine is one that has some simple (or complex in some cases) processing capability to be able to adapt to changing conditions. Such machines are suited for a host of applications, including automotive, aerospace, defense, medical, computers and electronics, telecommunications, consumer goods, and so on. This discussion will examine what’s possible with smart machines, and what tradeoffs need to be made to implement such a solution.